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                        H4522P007A-58DB
                        H4522P007A-58DB
                        产品概述:
                        详细介绍

                        1.SCOPE   范围

                        This specification shall be applied to electret condenser microphone(ECM) 本规格说明书适用于驻极体传声器

                        2.MODEL NO. 产品型号

                        H4522P007A-58DB

                        3.ELECTRICAL CHARACTERISTICS  电气特性

                        Temp. 环境温度

                        20 ± 2℃

                        Room Humidity 相对湿度

                        65 ± 5﹪

                        NO.

                        Parameter    参数

                        Symbol
                        符号

                        Condition 测试条件

                        Limits  范围

                        Unit
                        (单位)

                        Min.
                        最小值

                        Center
                        中心值

                        Max.
                        最大值

                        1

                        Sensitivity   灵敏度

                        S

                        f=1KHZ,S.P.L=1Pa,0dB=1V/Pa

                        -60

                        -58

                        -56

                        dB

                        2

                        Output impedance  输出阻抗

                        ZOUT

                        f= 1KHZ

                         

                         

                        2.2

                        3

                        Current Consumption  消耗电流

                        IDDS

                        Vcc=3.0V , RL=2.2KΩ

                        150

                         

                        500

                        uA

                        4

                        Signal to Noise Ratio  信噪比

                        S/N

                        f=1 KHZ , S.P.L=1Pa

                        60

                         

                         

                        dB

                        5

                        Decreasing Voltage 减电压灵敏度

                        △S-VS

                        Vcc=3.0V to 1.5V

                         

                         

                        -3

                        dB

                        6

                        Operating Voltage 工作电压

                         

                         

                        1

                         

                        10

                        V

                        7

                        Maximum input S.P.L  最大输入声压

                         

                         

                         

                         

                        110

                        dB

                        4.MEASUREMENT CIRCUIT  测试电路 
                        H4522P007A-58DB

                        5. TYPICAL FREQUENCY RESPONSE CURVE (FAR FIELD)  频响曲线
                            Far Field Measurement Condition  自由场测试条件
                            Temperature 温度 :  20   ± 2 ℃
                            Bias Voltage 基准电压:  2.0V (with 2.2K Ω series resistor 2.2KΩ电阻)
                            Acoustic stimulus :1Pa (94Db SPL at 1 KHZ ) at 50cm from the loud-speaker.
                         声音条件:The loud-speaker must be calibrated to make a flat frequency response input signal
                                           距离扬声器50cm出产生1Pa声压。 扬声器必须先用标准输入信号事先校准。
                        Position: The frequency response of microphone unit measured at 50cm from the loud-speaker
                        位置 :   扬声器距离待测话筒50cm. 
                        H4522P007A-58DB

                        6.DIMENSIONAL DRAWING  外形图:
                        H4522P007A-58DB

                        7.RELIABILITY TEST  可靠性测试
                        7.1 VIBRATION TEST 振动测试      1 minute frequency from 10Hz to 55Hz, amplitude 1.52mm, the vibration in three directions test 2 hours, the sensitivity deviation range of ± 3dB
                        1分钟频率变化从10Hz到55Hz,振幅在1.52mm,在三个方向测试振动2小时,灵敏度偏离范围在±3dB
                        7.2 DROP TEST   跌落测试 Three directions with the regular packaging of free fall from 1 meter at the concrete floor, the sensitivity range of ± 3dB deviation from the
                        以正规包装的三个方向从1米高处自由落到混凝土地面时,灵敏度偏离范围在±3dB
                        7.3 TEMPERATURE TEST   温度测试 -After exposure at 70℃ for 72 hours ,sensitivity to be within ±3dB from initial sensitivity
                        在70℃环境中维持72小时,灵敏度偏离范围在±3dB.
                        (The measurement to be done after 3 hours of conditioning at room temperature 测试在室内温度下放3小时后进行)
                         -After exposure at -20 ℃ for 72hours,sensitivity to be within ±3dB from initial sensitivity
                        在-20 ℃环境中维持72小时,灵敏度偏离范围在±3dB.
                        (The measurement to be done after 3 hours of conditioning at room temperature测试在室内温度下放3小时后进行)
                        7.4 HUMIDITY TEST 湿度测试 After exposure at 40℃ and 90﹪ relative humidity for 72 hours ,sensitivity to be within ±3dB from initial sensitivity
                        在40℃温度和90﹪相对湿度的环境下持续72小时,灵敏度偏离范围在±3dB.
                        (The measurement to be done after 3 hours of conditioning at room temperature测试在室内温度下放3小时后进行)
                        7.5 TESTCONDITION 测试条件 StandardTestCondition:     a)Temperature:+15℃~+35℃    b)Humidity:45%-75%  c)Pressure:86 kPa -106kPa
                        标准测试条件: a)环境温度:+15℃~+35℃  b)相对湿度:45%-75%  c)大气压力:86 kPa -106kPa
                        Judgement Test Condition:     a) Temperature:(20±2)℃     b) Humidity:60%-70%           c) Pressure:86 kPa -106kPa
                        判定测试条件 : a) 环境温度: (20±2)℃   b)相对湿度: 60%-70%  c)大气压力: 86 kPa -106kPa
                        8. TEMPERATURE CONDITIONS  温度条件
                        8.1 STORAGE TEMPERATURE  贮存温度: -20℃ ~ +70℃
                        8.2 OPERATING TEMPERATURE  操作温度: -20℃ ~ +70℃

                        9.MEASUREMENT SYSTEM  测量系统
                        H4522P007A-58DB 

                        10.REGARDING THE SOLDERING OPERATION  焊接注意事项
                        Every ECM contains a FET with microphone boby.This FET is easy to damageable from excessive heat and electrical shock.Proper attention for the soldering work is required same as followings.
                        每个ECM都包含有个FET.FET在过热和电流冲击下容易损坏。应遵循以下焊接操作规程:

                        1 -Recommend to use 15W ~ 35W ceramic soldering iron and apply 330±20℃temperature range 推荐使用功率在15W-35W,温度变化范围在330±20℃的陶瓷电烙铁。

                        2 -Soldering should be accomplished within 2 seconds at each terminal so as not to be overheated. 为防止过热,焊接应在2秒内完成。

                        3 -ECM shall be soldered fixed on the metal block(heat sink)which has the higher radiation effects. Heat sink shall contact with each of ECM. 应把驻极体传声器固定在散热良好的金属装置(散热板)上进行焊接.

                        4 -The pin hole soldering shall be avoided. 焊接后,各焊点不应出现砂眼(焊锡小孔)现象.

                        5 -E.C.M may easily destroyed by the static electricity,and the countermeasure for eliminating the static electricity(the ground for soldering copper,for worktable and for human body)shall be executed.
                        驻极体传声器容易受静电破坏,应采取防静电措施(焊接器具,工作台,操作人员人体应接地) 
                        H4522P007A-58DB

                        H4522P007A-58DB
                        12. List and Structure of Materials  材料及结构清单
                        H4522P007A-58DB

                        No. 序号

                        Part name   部件名称

                        1

                        防水网           FELT

                        2

                        外壳             Case

                        3

                        振膜             Diaphragm

                        4

                        垫片             Spacer

                        5

                        塑环             Housping Chamber

                        6

                        铜环             Copper ring

                        7

                        线路板           P.C.B

                        8

                        管芯             FET

                        9

                        极板             Back  plate

                        10

                        电容             CHIP CAPACITOR


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